This work presents the research, design and development of guided waves connections in semiconductor substrates (SiGe, GaAs). The integration of digital systems using Semiconductor Wave Guides (S-SIWG) with QAM modulation formats are highlighted. Ultra-fast inter-chip and inner-chip connections are associated with the new Gigabit Ethernet IEEE 802.3ba standard at 100Gbit/s extended to (0.5-1.5) Terahertz domain. Additionally fiber glass substrates with high losses (Teflon/FR-4) and high dielectric ceramic substrates (Er equal 80) are also developed to be integrated with microwave devices, analog printed circuits boards and high Speed digital circuits and systems.