The formation of stable metallic / polymeric joints is a huge challenge in materialsscience. Adhesion requires an interface that is capable of specifically interacting with themetallic phase. Polyimides have primary amino groups that are highly reactive to metalsurfaces. The coatings of these metal/polymer are mainly used as gas separationmembranes (permeability and permittivity) and as a low dielectric constant material formicroelectronic devices. This work provides the synthesis of metal/polymer coatings inpolyimide and kapton tape, by reduction with H2, with further understanding of the chemoabsorption mechanisms based on catalysts based on palladium, silver, sodium hypochloriteand the addition ofsolvents in the polyimide PIR 003, which allows the adhesion of copper.Copper precursors in CuSO(4).5H2O and CuCl(2), synthesized from CuO, were used forfurther reduction in H2 atmosphere and to obtain metallic copper in the coating, allowingthe development of new approaches for metallization of materials based on H2 reductionin polymers. The use of mathematical models allowed an approximate visualization of theadjustment of the parameters in the reduction of copper by H2. The contact anglemeasurements in the functionalized polyimides gave a visualization of the influence ofadhesion with copper and the characterization measurements were carried out in order toshow consistency of the results of the different treatments, among which were: FTIR,MEV-EDS, TGA, DRX. The present study demonstrates that with the CuSO4.5H2Oprecursor and the functionalization with 50 ml/l sodium hypochlorite in the polyimide, itpresented the largest crystallite size value of 61.8 nm and also the largest coating thicknessof 182 micrometers. Finally, the adhesion tests for the polyimide PIR 003-Cu with the precursor ofCuSO4.5H2O, in the untreated coating had a tensile strength of approximately 4MPa andin the case of the Sn/Pd treatment (0.1/0.2 g/l) a approximate average of 10 MPa.