Photovoltaic power generation has grown rapidly across the world and is starting to contribute a remarkable amount of electricity production on the world stage. To further develop the photovoltaic (PV) market, attract more investing companies and make it more competitive, production costs still need to be reduced and the efficiency of solar cells increased. Among all PV technologies, thin film solar cells based on III-V materials are the most successful and most promising technology to achieve the highest energy conversion efficiencies. Even with the active layer in the order of micrometers, thin film photovoltaics are produced on expensive rigid substrates, but indispensable as a crystallographic base and mechanical support in the production of the monocrystalline active layer. However, after obtaining the FV thin film, the original substrate is completely unnecessary, since it does not exert any functionality in the cell. In this way, there is a growing interest in technologies that allow the commercialization of solar cells on light, flexible and low-cost substrates, expanding not only the range of applicability, but also reducing production, transport and installation costs. This work will show the development of a general methodology for the transfer process of simple thin-film structures and complete solar cell structures of III-V materials epitaxially grown by MOVPE (Metal Organic Vapour Phase Epitaxy). III-V materials were transferred to different flexible bases and samples containing complete III-V solar cells were transferred to flexible copper substrate obtained by electrodeposition and to copper adhesive tape. The transfers were carried out successfully, without damaging the structure or the electrical contacts of the cells. Current voltage measurements, performed with a Sciencetech SF300A solar simulator, with AM1.5G filter, showed that cells on the flexible substrates, when compared to them on rigid substrates, showed little changes in their figures of merit. The bases tested showed adhesion, flexibility and mechanical support expected for the thin films and complete solar cells transferred.