The production of solid residues due to technological development has been increasing fast, mainly in developing countries. This growth leads to the manufacture of improved electronic products with varied functions, which not only are better versions of the old ones but also more sophisticated in their chemical compounds. The excessive consumption of the new devices contributes to an issue which has been increasing internationally: the accumulation of electronic waste. The raw material used in this study are samples of computer printed circuit boards (PCBs), which are a bus pattern that connects peripherals to the motherboard. Since the metal content in these residues are typically more elevated than in the ones located in natural reserves, it is interesting to find ways to recycle those residues while recovering components of interest or precursor concentrations in distinct groups for later metal recovery. Thermogravimetric analysis were performed on this approach in order to observe the best conditions of the process and the characterization of material and products was through SEM/EDS. Thus, this material, typically composed by organic material (such as plastic or PVC) and inorganic constituents (such as metals and alloys), undergoes a thermal processing in tubular furnace at 350 C degrees in inert atmosphere, followed by the concentration steps. The mass loss is constant from 300 C degrees on, around 30 percent. In the following steps, 15 percent of the total sample presents metallic components with high added value, such as Cu, Ni and Au, may be recovered.